The product cut system adopt Diameter, bore once punching Forming Process. Enable mesh has size tolerances small, concentricity
Port: ningbo
Minimum Order Quantity: 1000 Piece/Pieces
Supply Ability: 20,000 Piece/Pieces per Day
Payment Terms: L/C,T/T
Contact Supplier
Packaging Detail: as your required
Delivery Detail: 15days
professional using in grinding general metal,building metal,casting pig iro and welding metal.The grinding wheel is a litter hard with durability and rapiding ,its performance is better when used in penumatic tools and high speed machinery.
METRIC SYSTEM:125*3*22
INCH SYSTEM:5*1/8*7/8
RPM:11000RPM
PCS/CTN:17kg/200pcs/1ctn
Model No.: 14A1R
Features: 1, Vane Pump Rotor Slot CBN Grinding;
2, Vitrified CBN Grinding Wheels for slot grinding
3, CBN Grinding Wheel, Vitrified bond
Model No.: kingfu-tc-22
Features: vitrified bond wheels
available for the cemented steel,carbon steel,bearing steel,heat resistant steel,sintered alloy,etc
Model No.: V
Features: Abrasive Stone Segment for surface grinding application
Model No.:
Features: Abrasive steel flap wheel
1.First on-site checked by Alibaba
2.Supplier for building Bird's Nest
3.Max.speed:80m/s
Model No.: T27-A30#QB 70m/s
Features: 1.Max Speed: 70M/S
2.Sharply, durable and better balance
3.Used for drinding metal
4.Cost-effective
Model No.: hx20111117
Features: Metal bonded diamond glass wheel is mainly used for glass processing.
Model No.:
Features: resin bond diamond grinding wheel
1.shape:flat, cup ,dish, recessed,etc
2.resin
3.usage:polish hard alloy and other tool
Model No.: DT-C3503032
Features: 1. Premium silicon carbine grain
2. Perfect ratio between cutting performance and life
13. For all stone cutting application
Model No.: 1A1
Features: 1)used for processing kinds of material
2)Abrasive layer:vitrified diamond
3)high quality
3)various types and sizes available
Model No.: kingfu-tc-22
Features: vitrified bond wheels
available for the cemented steel,carbon steel,bearing steel,heat resistant steel,sintered alloy,etc
Model No.: 1A1
Features: Ultra Thin Diamond Dicing Blade.
Thickness from 0.02mm to 0.8mm.
For Semiconductor Components Dicing and Cutting.
Model No.: S19
Features: glass diamond OG wheel S19
1.Materials:diamond sand
2.High qulity and low cost diamond OG wheel
3.For processing glass edge