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Diamond Dicing Blade - 1A1

Ultra Thin Diamond Dicing Blade., Thickness from 0.02mm to 0.8mm., For Semiconductor Components Dicing and Cutting. - more info check here: //www.buyindustrialtools.com/Diamond-Dicing-Blade-10002749/

Quick Brief

Place of Origin: Henan China (Mainland) Brand Name: Zhengzhou Hongtuo Model Number: 1A1 Shape: Cylindrical Abrasive: Diamond Bonding Agent: Other Abrasive: Diamond

Product Features:

Ultra Thin Diamond Dicing Blade.

Thickness from 0.02mm to 0.8mm.

For Semiconductor Components Dicing and Cutting.

Business Terms:

Port: Shanghai/ Beijing

Minimum Order Quantity: 1 Piece/Pieces

Supply Ability: 3000 Piece/Pieces per Month

Payment Terms: L/C,T/T,Western Union,Paypal

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Diamond Dicing Blade
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Product Packagings & Delivery Terms:

Packaging Detail: Plastic box

Delivery Detail: 2 Weeks after receipt of order.

Specifications and Product Details:

Ultra Thin Diamond Cutting Wheels/ Dicing Blade

Leading manufacturer of diamond and CBN Ultra thin cutting wheels.Our diamond

and CBN Ultra thin cutting wheel are designed to used in Semiconductor,Micro-electronics,Glass and Ceramic industires.It can finely cutting varieties of hard and fragle materials.It shows the features of high efficiency,high precsion and long tool life.

Diameter from 30mm to 180mm

Thickness from 0.02mm to 0.8mm

Custom-made is possible.

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