Ultra Thin Diamond Dicing Blade.
Thickness from 0.02mm to 0.8mm.
For Semiconductor Components Dicing and Cutting.
Port: Shanghai/ Beijing
Minimum Order Quantity: 1 Piece/Pieces
Supply Ability: 3000 Piece/Pieces per Month
Payment Terms: L/C,T/T,Western Union,Paypal
Contact SupplierPackaging Detail: Plastic box
Delivery Detail: 2 Weeks after receipt of order.
Ultra Thin Diamond Cutting Wheels/ Dicing Blade
Leading manufacturer of diamond and CBN Ultra thin cutting wheels.Our diamond
and CBN Ultra thin cutting wheel are designed to used in Semiconductor,Micro-electronics,Glass and Ceramic industires.It can finely cutting varieties of hard and fragle materials.It shows the features of high efficiency,high precsion and long tool life.
Diameter from 30mm to 180mm
Thickness from 0.02mm to 0.8mm
Custom-made is possible.