Advanced soldering flux paste - BK-223

• Advanced soldering flux paste detail:

1.high effect of help soldering

2.won't corrode IC snd PCB

3.lead free,environmental and makes no smoke.

4.suit for the precision chip of mobile phone,PCB card

• Feature:

Type:Rosin-based,non-halide ions

Compliant:Military and other reliability of theiruit components.

• Advanced soldering flux paste Paste BK-223.

1.The BK-223 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.

2.These flux paste are specially formula for BGA reballing / balls works, they not only stick the balls much more well then regular flux, but also provide easy bonding with component pad to balls with typical oven profile.

• Payment:
• We accept Alipay, West Union, TT,
• Payment must be made within 3 days of order.
• If you can't checkout immediately after auction close, please wait for a few minutes and retry Payments must be completed within 3 days.
• Shipping:

We guarantee to ship out within 48 hours after payment confirmation (except Holiday).Once the payment is received please allow 48 hours for dispatch of the order. The delivery to your country may take from 5 to 7 working days after order has been shipped. Some times items will be delayed due to unexpected reason. Please contact us if you don't receive your package exceeded 10 business days excludes weekends and holidays. Please understand that most international delivery delays are postal delays that we are not aware of until you let us know.

• Our company accept all trading manners:e.g EXW,FOB,CIF,DDP,DDM.
  We can also acceptany kinds of payment terms,such as TT,L/C,D/P,O/A etc.