Specifications and Product Details:

ZM-R6821 BGA repair computers

ZM - R8650
ZM - R8650 product specifications and technical parameter index below
1 9800W total power
2 1200W upper heating power
3 lower heating power second temperature area 7200W 1200W, third temperature area
The power supply AC220V + 10% 50/60Hz
5 shape dimension 1100 x 13 x 1700mm (not including display stents)
6 localization way letter V card slot, configuration universal fixture
7 temperature control K type thermocouple (K) closed-loop control, be independent control temperature, precision can reach + 1 degree;
8 PCB size Max 500 x 600mm Min 10 x 20 mm
9 electrical material panasonic servo drive
10 contrapuntal system computer automation images automatic acquisition registration
80X80mm 2X2-11 applicable chip
12 external temperature measuring port 5
13 working way computer intellectualized operation
14 placement accuracy X, Y and adopt servo drive, Angle of R precision can reach + 0.005 MM
15 400kg machine weight

* product features:
R8650 main performance and features:

1, the machine adopts industrial control computer control, automatic visual contrapuntal system can through the CCD will BGA and PCB image acquisition to image alignment processing system, again through the image processing software and contrapuntal calculated offset the position and Angle, and then transmitted to the servo drive motors for position controller, thus completing BGA rectify correction of mounted, fast response, alignment precision can reach + 0.005 MM. With a keyboard, mouse and 15 "of hd LCD.

2, mounted process, the machine will automatically analysis, search, fixed BGA and PCB position, and through the suction nozzle gleaned BGA will automatically at the designated the pasted on the pad, desoldering can automatically when the PCB taken to designated position place BGA.

3 and the upper heaters can all-around move freely, system X, Y and R Angle adopts panasonic servo control system, vs. Optical alignment can be 360 degrees of arbitrary rotation system, and through the automatic correction system, so as to be automatic vs the PIN bits and on BGA PCB pad center perfectly.

4, mounted machine speed can be set according to the job requirement, the operation is convenient and flexible.
5, the upper heating device and pasted on the head to ensure the independent design, air suction pen from the influence of deformation. The Z axis for screw transmission, panasonic servo control system, can precisely control association with added to hot. Equipped with various specifications titanium alloy BGA wind mouth, the wind can be 360 degrees of arbitrary rotation mouth, easy to install and replacement, can according to customers' special requirements.

6, the machine adopts three temperature area independent control temperature, one, two temperature area hot air heating and can make more paragraphs temperature control, the third temperature area of PCB large IR heater preheated to ensure comprehensive homogenous plate expansion coefficient deformation, the heating temperature, time, slope, cooling, alarm all in display shows.
7, with high K type thermocouple closed-loop control and intelligent PID temperature automatic compensation system, and combined with panasonic PLC and high sensitive temperature module implements accurate control of temperature, maintain temperature deviation plus or minus 1 degrees. Meanwhile in external 5 temperature measuring interface implementation on the temperature precision testing, and realize the actual temperature curve accurate analysis and proofreading.

8, PCB v-shape slot, positioning of the positioning quick, convenient, accurate, meet different PCB layout mode and the different size PCB positioning.

9, flexible and convenient portable everything on the fixture protect PCB board, prevent PCB edge device injury and PCB deformation, and can adapt to all kinds of BGA encapsulation size of repair.

10, mounted, welding, remove process realizes intelligent control, and can be mounted, welding, disassemble. BGA mounted position control precision. BGA remove, welding finished with voice alarm function. In temperature abuse cases, circuit can automatically without electricity, has dual overtemperature protection function.
11, can store 1000 group temperature setting parameters and memory 1,000 different sets BGA chip to add hot and dot, can at any time on the display temperature parameters set curve analysis and correction of the eight pieces. Display temperature curve and storage multiple user data, and have instant curve analysis function.

12, in dismantling, welding finished with large flow transverse fan automatic for PCB for cooling, prevent PCB deformation, ensure welding effect.

13, desoldering process the greenhouse gas emissions caused by automatic vent discharge waste device can ensure the operator to go outside, health and environmental protection.

14, the machine is equipped with pressure sensor and optical sensors, through the pressure sensor and photoelectric switches make pressure control in 3 to 10 grams of tiny range, allowing it to automatically identify absorb charge and mounted height. To ensure that don't crush the BGA chip to lead-free. Can Socket775 and double BGA/CGA outlets/IC and various devices such as repair shielded enclosure, adapt to lead-free process requirements.

* size specification:
Size:
Weight: KG