power consumption:320W
air pump:membranous
air flow:<=24L/min
temperature range:
dimension: 187 X 135 X245
Feature:
- ESD safe by design.
- PID controlled closed loop of sensor,rapid heating,precise and stable temperature.suitable for desoldering surface mounted ICs,such as QFP,PLCC,SOP,BGA etc.
- intelligent cooling system.deferred air delivery after switch off upon completion of rework and automatically switch off power supply when temperature is below 100 degree.
- Use alloy heating wire, long service life.
Specification:
- power consumption:320W
- air pump:membranous
- air flow:<=24L/min
- temperature range:
- 100~480°C
- dimension: 187 X 135 X245
- weight:4kg