diamond resin wheel for abrasive - customized

diamond resin wheel for abrasive, 1)diamond resin wheel, 2)High quality diamond resin wheel, 3)High intenstity resin wheel - more info check here: //www.buyindustrialtools.com/diamond-resin-wheel-for-abrasive-10139176/

Quick Brief

Place of Origin: Guangdong China (Mainland) Brand Name: JinRui Model Number: customized Shape: Dish Abrasive: Diamond Bonding Agent: Resin Hardness: High Viscosity: High Size: Dia 150-300 Type: abrasive disc MOQ: 10PCS Quality: high Service: OEM Material for working layer: Diamond powder Market: all over the world Usage: grinding glass Circle: diamond tools Diamond grit: 30/35....325/400 Intensity: high

Product Features:

diamond resin wheel for abrasive

1)diamond resin wheel

2)High quality diamond resin wheel

3)High intenstity resin wheel

Business Terms:

Port: guangzhou

Minimum Order Quantity: 10 Piece/Pieces pcs

Supply Ability: 1000 Piece/Pieces per Month week

Payment Terms: L/C,T/T,Western Union

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Specifications and Product Details:

diamond resin wheel for abrasive:
1)diamond resin wheel
2)High quality diamond resin wheel
3)High intenstity diamond resin wheel

Resin diamond grinding wheel:
The resin bond grinding wheel have the features of good self-sharpening, sharp cutting, high efficiency, low roughness of work piece surface, few heat generating and without burning workpiece.

Our institute is able to provide resin bond superabrasive grinding wheels according to the standard GB/T6409.2-1996. The diameter range is 10~700mm;the thickness range is 0.07~300mm;the grit size range is 60/70~W3.5. We can also design and make nonstandard grinding wheels according to customer’s requirement.

Application:

Resin bond diamond products: mainly used for machining tungsten carbide , ceramic materials, magnetic materials, silicon materials, silicon materials, thermal spraying alloy materials etc.

Resin bond CBN products: mainly used for machining high speed steel, cast iron etc.

Resin diamond grinding wheel for silicon slice back-thinning

Work piece: IC ,Discrete device bottom silicon slice,Original silicon slice

Advantage: High speed, High quality, Wear resistant.

Type	D(mm)	H(mm)	W(mm)	X(mm)	Bond
6A2	175	76	5	5	B/V
6A2H	350	127	5	5
6A2T	195	170	4.5	5
6A2T	350	235	4.5	5
6A2T/P	209	158	4.5	5

Resin diamond grinding wheel for cutter processing

Work piece: Round saw blade, the former angle and relief angle for the bandsaw , the side NC grinding machine and Woodworking Drill.

Advantage: High efficient, High precision, Long life, Shape keeps well.

Type	D(mm)	T(mm)	W(mm)	X(mm)
14A1	75-500	6-20	3-6	3-16
4A2	150/200/250	10/13	3/6/10	1.5/3
4V2	150/200/250	10/13	3/6/10	U=1.5-3
6A2	50/75/100/125/150/175/200	13/20	3/5/6/10/12/15/203	1.5/3