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Touch Screen Hot Air BGA Machine - WDS-450S

BGA Machine, 1.BGA Rework Station, 2.Movable lower heating zone, 3.Passed CE & ISO, 4.Hot Air & IR - more info check here: //www.buyindustrialtools.com/Touch-Screen-Hot-Air-BGA-Machine-10275792/

Quick Brief

Place of Origin: Guangdong China (Mainland) Brand Name: Wisdomshow Model Number: WDS-450S Type: Power Tool Parts Maximum PCB size: L550*W500mm PCB thickness: 0.5~2.5 mm Chips apply: 1*1~70*70mm Chip minimum space apply: 0.15mm PCB locating way: Fixture located Temperature controlling way: K-tape thermocoupl... Lower hot air heating: Hot air 800W,movable Upper hot air heating: Hot air 800W Machine weight: Approx60KG bga station: rework bga

Product Features:

BGA Machine

1.BGA Rework Station

2.Movable lower heating zone

3.Passed CE & ISO

4.Hot Air & IR

Business Terms:

Port: FOB Shenzhen and FOB HongKong

Minimum Order Quantity: 1 Set/Sets

Supply Ability: 500 Set/Sets per Month

Payment Terms: L/C,T/T,Western Union,MoneyGram,paypal

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Touch Screen Hot Air BGA Machine
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Product Packagings & Delivery Terms:

Packaging Detail: Customized

Delivery Detail: within two weeks after getting your full payment

Specifications and Product Details:

Touch Screen Hot Air BGA Machine

Features

  • High quality heating material ensures desoldering and soldering procedures of BGA are precisely controlled;
  • Auto-generated profile, no need to adjust or change temperature on the profile;
  • Adjustable Air flow and temperature within a wide range to produce high temperature breeze;
  • Movable heating head and lower heating zone for easy operation
  • Touch screen interface; 3 heaters; real-time temperature curve display on touch screen;
  • Embeded industrial computer, PLC control; able to disply set profile and testing profile at the same time; analyze the profile,compared with saved history profiles;
  • 8 segments of temperature up(down) and 8 segments constant temperature control, unlimited profiles saving;
  • Up/down adjustable lower hot air nozzle;
  • Buzz after soldering or desoldering is finished;
  • With different alloy hot gas nozzles, easy to replace.It could be tailored as per the specific requirements.
  • The whole bottom IR preheating area can move along with X axis, so as to meet the need of different BGA repair and bigger size PCB

Technology parameters

Style NO.WDS-450s
Maximum PCB sizeL550*W500mm
PCB thickness0.5~2.5 mm
Chips apply1*1~70*70mm
Chip minimum space apply0.15mm
PCB locating wayFixture located
Temperature controlling wayK-tape thermocouple, closed loop control
Lower hot air heatingHot air 800W
Upper hot air heatingHot air 800W
Bottom pre-heatingIR 2700W
Power appliesSingle phase: 220V, 50/60 Hz
Machine sizeL620*W640*H600mm
Machine weightApprox60KG

Heat Tape

BGA Flux Paste

BGA Oven

Constant Temperature Heater

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