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Surface Grinding Wheel for Silicon Wafer

1. For semiconductor industry, 2. For silicon/ sapphire wafer, 3. Resin/ Metal Bond Diamond Wheel, 4. Looking for Sales Agent - more info check here: http://www.buyindustrialtools.com/Surface-Grinding-Wheel-for-Silicon-Wafer-10134047/

Quick Brief

Place of Origin: Japan Abrasive: Diamond Bonding Agent: Resin

Product Features:

1. For semiconductor industry

2. For silicon/ sapphire wafer

3. Resin/ Metal Bond Diamond Wheel

4. Looking for Sales Agent

Business Terms:

Minimum Order Quantity: 1 Piece/Pieces

Payment Terms: T/T in advance

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Surface Grinding Wheel for Silicon Wafer
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Product Packagings & Delivery Terms:

Specifications and Product Details:

Tokyo Diamond offers the surface grinding wheels for silicon wafers and various substrates. We also propose various types of wheels to meet demands on the thickness and slicing of wide variety of electronics parts and devices.

Line up:

BL Series Resin bond wheel for silicon wafers

"METALEX" Series Metal bond wheel for sapphire wafers

Surface Grinding Wheel for Silicon Wafer suppliers    Surface Grinding Wheel for Silicon Wafer manufacturers