1. For semiconductor industry
2. For silicon/ sapphire wafer
3. Resin/ Metal Bond Diamond Wheel
4. Looking for Sales Agent
Minimum Order Quantity: 1 Piece/Pieces
Payment Terms: T/T in advance
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Tokyo Diamond offers the surface grinding wheels for silicon wafers and various substrates. We also propose various types of wheels to meet demands on the thickness and slicing of wide variety of electronics parts and devices.
Line up:
BL Series Resin bond wheel for silicon wafers
"METALEX" Series Metal bond wheel for sapphire wafers