QUICK2120 sirocco repair system BGA rework station - QUICK2120 sirocco repair system

QUICK2120 sirocco repair system
QUICK2120 BGA repair machine main advantages
In order to ensure uniform heat * distribution and proper peak temperature, realize high reliable lead-free soldering. QUICK2120 the closed-loop principle, the top heater with hot air heating, local corresponding BGA, infrared heating part corresponding whole PCB, prevent PCB local deformation.
QUICK2120 optical for * * prism for 60 60mm, large BGA proof still clearly visible and contrapuntal JingXia adopt the motor control, and the camera is placed above store tray chip. PCB bracket using box, and can be placed fractal structure of special-shaped board support bar, bottom supporting rod and wishbone connected, facilitate each time when placed PCB consistent. Using linear precision guide. Joystick. Screw transmission control precision, X, Y, Z, theta precision adjustment, each azimuth macro-regulating through precise motor control, reducing think factor influence.
* QUICK2120 except to adjust X.Y.Z. potolli chip precision using manual fine-tuning outside, theta. Chip stick put chip loot. Lens magazine mobile. Backflow control. Heating head mobile. Chip removal, etc are automatic control, the lead-free repare more can reflect the unique.
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The main technique parameters power specifications
220V, 50Hz, 2.5 KW

Maximum PCB size
300 * 300mm

Smallest chip size
2 * 2mm

Largest chip size
60 * 60mm

Bottom radiation preheating size
550 * 450mm

LCD display window
100 * 75 (mm) and * 2 characters

Patch precision
+ 0.025 mm

Hot air heating temperature
500 °C (Max)

Bottom preheating temperature
500 °C (Max)

Top hot air heating power
700W

Bottom hot air heating power
700W

Bottom infrared preheating power
800W

Lateral cooling fan is adjustable speed 3.5 m3 / min

Camera meter
The 12V / 300mA; 22 * 10 times as large; Flat articulation 480 lines, PAL shape.whether

Infrared K type sensor
5

communication
Standard 232C rs-five (with PC online)

Envelop dimensions
600 (L) * 600 (W) * 500 (H) mm

Equipment weight

50Kg

Applicable occasions: applicable to a notebook, desktops, servers, industrial board, switches production and repair process for BGA, CSP, QFP PLCC, etc. Various encapsulation device of welding, dismantling or repair, and can fully satisfy the requirements of lead-free soldering.