Applicable occasions: applicable to a notebook, desktops, servers, industrial board, switches production and repair process for
Minimum Order Quantity: 1 Plant/Plants
Supply Ability: 100 Plant/Plants per Week
Payment Terms: T/T,Western Union
Contact SupplierPackaging Detail: NORMAL PACKING
Delivery Detail: 1-3 DAYS
QUICK2015BGA repair system main component
1. IR2015BGA repair system infrared reflow soldering part
Infrared temperature sensor directly detection BGA surface temperature, to realize closed loop control to ensure accurate temperature process window, heat distribution is uniform.
2. IRsoft welding process control software
Connect the PC can record, control, analysis the whole process flow, and produce graphs, satisfy the modern electronic industrial process requirements.
3. PI2015BGA repair system precision contrapuntal stick put system
Adopt double color vision matchup, visible and welding plate of solder ball control precision, coincide contrapuntal science simple, stick put freely.
4. RPC2015BGA repair welding process control camera meter system
Can from different Angle observation BGA tin ball melting process, to capture accurate and reliable technology curve provide key help.
QUICK2015BGA repair system main technical parameters
IR infrared repair system models: IR2015
The total power 2800W (Max) :
Bottom preheating power: 500W * 4 = 2000W (outside sends heat pipe/dark red, outside heaters optional) or400W * 4 = 1600W
Top heating power: 180W * 4 = 720W (infrared hair heat pipes, about 2-8 muon wavelength m)
Top heater size: 60 * 60mm
Bottom radiation preheater size: 267 * 280mm
Top heater adjustable scope: 20-60mm (X, Y direction are adjustable)
Vacuum pump: 300mA 12V / 0.05 Mpa (Max)
Top cooling fan: 300mA 15CFM 12V /
Laser tube: 30mA 3V/vs
24VDC/move motor: 100mA
Move up and down. 93mm trip: arm
Maximum PCB size: 420mm * 500mm
LCD display window: 65.7 * 23.5 mm 16 * 2 characters
Communication: the rs-five 232C (with PC online)
Infrared measuring temperature sensor: 0-300 °C (temperature measuring range)
External K type sensor: optional parts
PL precision stick put system models: PL2015
Power: about 15W
Camera meter: 22 * 10 times as large; The 12V / 300mA; Level articulation lines, PAL shape.whether
The prism size: 60 * 60mm
Can the BGA size vs 60 * 60mm
Vacuum pump 12V / 600mA 0.05 Mpa (Max)
Camera meter VIDEO VIDEO signal output signal
Weight 22Kg
RPC reflow soldering process camera meter type RPC2005
Power about 15W
Camera meter 22 * 10 times as large; The 12V / 300mA; Level articulation lines, PAL shape.whether
Applicable occasions: applicable to a notebook, desktops, servers, industrial board, switches production and repair process for BGA, CSP, QFP PLCC, etc. Various encapsulation device of welding, dismantling or repair, and can fully satisfy the requirements of lead-free soldering.