PLC Controlled Hot Air BGA Rework Station to Solder and Desolder All Sealed Chips - WDS-660

Hot Air BGA Rework Station, 1.PLC controlled, 2.Hot Air & IR heating, 3.Color optical alignment system, 4.Passed CE & ISO - more info check here: //www.buyindustrialtools.com/PLC-Controlled-Hot-Air-BGA-Rework-Station-to-Solder-and-Desolder-All-Sealed-Chips-10129847/

Quick Brief

Place of Origin: Guangdong China (Mainland) Brand Name: Wisdomshow Model Number: WDS-660 Type: Power Tool Parts Certificate: CE,ISO Usage: soldering and desoldering bga Price: Competitive Total Power: Max 6800W Upper Heating Power: 1200W Lower Heating Power: Second zone: 1200W, Third ... Power Supply: (Single Phase)AC 220V±10V 50Hz±3H... Positioning Way: V-shape card slot, PCB holder ... PCB Size(Max): 440*450mm PCB Size (Min): 15*22mm

Product Features:

Hot Air BGA Rework Station

1.PLC controlled

2.Hot Air & IR heating

3.Color optical alignment system

4.Passed CE & ISO

Business Terms:

Port: FOB Shenzhen and FOB HongKong

Minimum Order Quantity: 1 Set/Sets

Supply Ability: 500 Set/Sets per Month

Payment Terms: L/C,T/T,Western Union,MoneyGram,payapl

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Specifications and Product Details:

PLC Controlled Hot Air BGA Rework Station to Solder and Desolder All Sealed Chips

Features

1. Touch screen interface and PLC controlling. display 3 temperature curves in any time. The temperature is controlled accurately between -1 degree and 1 degree.

2. 6 segments controlling temperature, which could be controlled pre-heating, stillstand, heating, soldering 1, soldering 2 and cooling. The first-rate temperature controlling effectively ensure soldering effect.

3. The machine could save 1-100 phases temperature curves. You could analyze curve and change setting at touch screen.

4. There are 3 independent heating zones. The first and second heating zone could control the temperature in numerous phrases and the third heating zone pre-heating whole PCB so that achieve the best soldering effect. The temperature,time,slope,alarm are all displayed in the touch screen.

5. Accurately inspect temperature by high accurate K-type thermocouple with closed loop control. External temperature measurement interface detect temperature accurately.

BGA Reball Process

Technology Parameters

Total Power	Max 6800W
Upper Heating Power	1200W
Lower Heating Power	Second zone: 1200W, Third zone: IR 4200W
Power Supply	(Single Phase)AC 220V±10V 50Hz±3Hz 5.4 KVA
Machine Dimension	L1000W680H900mm
Positioning Way	V-shape card slot, PCB holder can be adjustable by X and Y axes
Temperature Controlling	K-type thermocouple closed loop control, independent temperature control
PCB Size(Max)	440*450mm
PCB Size (Min)	15*22mm
PCB Blowup Diploid	10-100X
Weight of machine	120Kg
Thermocouple Ports	4 units