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PLC Controlled BGA Rework Station to Solder and Desolder All Sealed Chips/BGA - WDS-660

BGA, 1.PLC controlled, 2.Hot Air & IR heating, 3.Color optical alignment system, 4.Passed CE & ISO - more info check here: http://www.buyindustrialtools.com/PLC-Controlled-BGA-Rework-Station-to-Solder-and-Desolder-All-Sealed-Chips-BGA-10135201/

Quick Brief

Place of Origin: Guangdong China (Mainland) Brand Name: Wisdomshow Model Number: WDS-660 Type: Power Tool Parts Certificate: CE,ISO Usage: soldering and desoldering bga Price: Competitive Total Power: Max 6800W Upper Heating Power: 1200W Lower Heating Power: Second zone: 1200W, Third ... Power Supply: (Single Phase)AC 220V±10V 50Hz±3H... Positioning Way: V-shape card slot, PCB holder ... PCB Size(Max): 440*450mm PCB Size (Min): 15*22mm

Product Features:

BGA

1.PLC controlled

2.Hot Air & IR heating

3.Color optical alignment system

4.Passed CE & ISO

Business Terms:

Port: FOB Shenzhen and FOB HongKong

Minimum Order Quantity: 1 Set/Sets

Supply Ability: 500 Set/Sets per Month

Payment Terms: L/C,T/T,Western Union,MoneyGram,payapl

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PLC Controlled BGA Rework Station to Solder and Desolder All Sealed Chips/BGA
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Product Packagings & Delivery Terms:

Packaging Detail: wooden case or customized

Delivery Detail: within two weeks after your order is confirmed

Specifications and Product Details:

PLC Controlled BGA Rework Station to Solder and Desolder All Sealed Chips/BGA

Features

1. Touch screen interface and PLC controlling. display 3 temperature curves in any time. The temperature is controlled accurately between -1 degree and 1 degree.

2. 6 segments controlling temperature, which could be controlled pre-heating, stillstand, heating, soldering 1, soldering 2 and cooling. The first-rate temperature controlling effectively ensure soldering effect.

3. The machine could save 1-100 phases temperature curves. You could analyze curve and change setting at touch screen.

4. There are 3 independent heating zones. The first and second heating zone could control the temperature in numerous phrases and the third heating zone pre-heating whole PCB so that achieve the best soldering effect. The temperature,time,slope,alarm are all displayed in the touch screen.

5. Accurately inspect temperature by high accurate K-type thermocouple with closed loop control. External temperature measurement interface detect temperature accurately.

BGA Reball Process

Technology Parameters

Total PowerMax 6800W
Upper Heating Power1200W
Lower Heating PowerSecond zone: 1200W, Third zone: IR 4200W
Power Supply(Single Phase)AC 220V±10V 50Hz±3Hz 5.4 KVA
Machine DimensionL1000*W680*H900mm
Positioning WayV-shape card slot, PCB holder can be adjustable by X and Y axes
Temperature ControllingK-type thermocouple closed loop control, independent temperature control
PCB Size(Max)440*450mm
PCB Size (Min)15*22mm
PCB Blowup Diploid10-100X
Weight of machine120Kg
Thermocouple Ports4 units

The Detail Pictures

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