On Sale! High Quality Hot Air Chips Rework Machine - WDS-450S

Chips Rework Machine, 1.Lowest EXW, 2.Movable lower heating zone, 3.Passed CE & ISO, 4.Hot Air & IR - more info check here: http://www.buyindustrialtools.com/On-Sale-High-Quality-Hot-Air-Chips-Rework-Machine-10030385/

Quick Brief

Place of Origin: Guangdong China (Mainland) Brand Name: Wisdomshow Model Number: WDS-450S Type: Power Tool Parts Maximum PCB size: L550*W500mm PCB thickness: 0.5~2.5 mm Chips apply: 1*1~70*70mm Chip minimum space apply: 0.15mm PCB locating way: Fixture located Temperature controlling way: K-tape thermocoupl... Lower hot air heating: Hot air 800W,movable Upper hot air heating: Hot air 800W Machine weight: Approx60KG bga soldering: chip soldering

Product Features:

Chips Rework Machine

1.Lowest EXW

2.Movable lower heating zone

3.Passed CE & ISO

4.Hot Air & IR

Business Terms:

Port: FOB Shenzhen and FOB HongKong

Minimum Order Quantity: 1 Set/Sets

Supply Ability: 500 Set/Sets per Month

Payment Terms: L/C,T/T,Western Union,MoneyGram,paypal

Contact Supplier

Specifications and Product Details:

On Sale! High Quality Hot Air Chips Rework Machine

Features

High quality heating material ensures desoldering and soldering procedures of BGA are precisely controlled;
Auto-generated profile, no need to adjust or change temperature on the profile;
Adjustable Air flow and temperature within a wide range to produce high temperature breeze;
Movable heating head and lower heating zone for easy operation
Touch screen interface; 3 heaters; real-time temperature curve display on touch screen;
Embeded industrial computer, PLC control; able to disply set profile and testing profile at the same time; analyze the profile,compared with saved history profiles;
8 segments of temperature up(down) and 8 segments constant temperature control, unlimited profiles saving;
Up/down adjustable lower hot air nozzle;
Buzz after soldering or desoldering is finished;
With different alloy hot gas nozzles, easy to replace.It could be tailored as per the specific requirements.
The whole bottom IR preheating area can move along with X axis, so as to meet the need of different BGA repair and bigger size PCB

Technology parameters

Style NO.	WDS-450s
Maximum PCB size	L550*W500mm
PCB thickness	0.5~2.5 mm
Chips apply	11~7070mm
Chip minimum space apply	0.15mm
PCB locating way	Fixture located
Temperature controlling way	K-tape thermocouple, closed loop control
Lower hot air heating	Hot air 800W
Upper hot air heating	Hot air 800W
Bottom pre-heating	IR 2700W
Power applies	Single phase: 220V, 50/60 Hz
Machine size	L620W640H600mm
Machine weight	Approx60KG