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ESD(Electro Static Discharge)Protection Device - LED surge protection - RD2301

Chip size : 0.40 mm x 0.33 mm, Top metal : Al or Au, Back metal : Au, Bonding PAD : 0.11 mm x 0.28 mm - more info check here: http://www.buyindustrialtools.com/ESD-Electro-Static-Discharge-Protection-Device-LED-surge-protection-12002628/

Quick Brief

Place of Origin: Daejeon South Korea Brand Name: RFsemi Model Number: RD2301 Wafer thickness: 100 μm ± 10 μm Chip size: 0.40 mm x 0.33 mm Top metal: Al or Au Back metal: Au Bonding PAD: 0.11 mm x 0.28 mm

Product Features:

Chip size : 0.40 mm x 0.33 mm

Top metal : Al or Au

Back metal : Au

Bonding PAD : 0.11 mm x 0.28 mm

Business Terms:

Port: Incheon, South Korea

Payment Terms: L/C,T/T

Contact Supplier

ESD(Electro Static Discharge)Protection Device - LED surge protection

Product Packagings & Delivery Terms:

Packaging Detail: P4026 , P6020

Delivery Detail: 2 weeks after P.O

Specifications and Product Details:

Features
- Common cathode type surge protection diode
- P/N Diode
- Electrodes :
Top side : Cathode (Al)
Back side : Anode (Au)

Application Circuits

Wafer thickness : 100 μm ± 10 μm
Chip size : 0.40 mm x 0.33 mm
Top metal : Al or Au
Back metal : Au
Bonding PAD : 0.11 mm x 0.28 mm

Chip size Includes scribe lane. The chip size is about (0.38±0.015 x 0.31±0.015) mm2 after dicing.

Absolute Maximum Ratings at TA = 25 o C