BGA rework station for ZM-R5850C - ZM - R5850C

ZM - R5850C technical parameters:

1 4800W total power
2 the upper heating power 800W
3 lower heating power second temperature area 1200W, and the third (IR) temperature area 2700W
The power supply AC220V + 10% 50/60Hz
5 shape dimension 635 x 600 x 560mm
6 localization way v-shape card slot, PCB stents X, Y any direction can be adjusted and configuration universal fixture
7 temperature control K type thermocouple (K) closed-loop control, be independent control temperature, precision can reach + 3 degrees;
8 PCB size 370mm Min 20 Max 410 x x 20 mm
9 machine weight 40kg

* product features:
ZM - R5850C performance and features:

1, using linear slider make X, Y, Z triaxial all can do fine fine-tuning or rapid positioning action, has high location accuracy and quick maneuverability.
2, the machine adopts high precision temperature control meter, built-in PC serial ports, external temperature measuring interface, with software, can realize the computer control.
3, adopt three temperature area, fluctuation temperature area independent heating air heating, bottom temperature area infrared heating, temperature precise control in + 3 degrees, the upper temperature area visible need to move freely, the second temperature area can be up-down adjustment, top and bottom heaters can also set up more paragraphs to control temperature. IR preheating zone can adjust the output power in accordance with the actual requirements.
4, equipped with various specifications titanium alloy BGA wind mouth, the wind can be 360 degrees of arbitrary rotation mouth, easy to install and replacement, can according to customers' special requirements.
5, selection of high-precision K, outer closed-loop control thermocouple temperature measurement interface implementation on the temperature precision testing. PCB v-shape slot, positioning of the flexible and convenient portable everything on the fixture protect PCB board, prevent PCB edge device injury and PCB deformation, and can adapt to all kinds of BGA encapsulation size of repair.
6, adopt high-power cross-flow fan of PCB quickly for cooling, improve the work efficiency. Meanwhile built-in vacuum pumps, external vacuum pen, with convenient take take BGA chip.
7, welding after work has alarm prompt functions, for the convenience of customers use special increase "early alarm" function.
8, the machine after CE certification, with a sudden stop switch and abnormal accident automatic power protection device. In temperature abuse cases, circuit can automatically without electricity, has dual overtemperature protection function.
9, this machine adopts CCD visual system, the welding and of BGA desoldering the melting process, provide accurate judgement read key visual.