ZM-BIP3000 BGA repair computers
Minimum Order Quantity: 1 Plant/Plants
Supply Ability: 100 Plant/Plants per Week
Payment Terms: T/T,Western Union
Contact SupplierPackaging Detail: NORMAL PACKING
Delivery Detail: 1-3 DAYS
BIP3000 ZM - type number:
Specifications and technical parameters:
01 3700W Powerused total power
02 Main Heater 600W upper heating power
03 bottom Heater 3000W Sub heating power
04 210V - Powerused AC power 230V 50Hz + 3
05 L780 Machine configuration dimensions W520 * * * * * H460mm dimension
06 localization way Positioning V type card slot
07 Temperature control Temperature control infrared sensors
08 maximum PCB Size Max. Do 320mm 370 * PCB
09 machine machine Weight of 35 kg Weight
* product features:
Special point:
1, the repair machine suitable for notebook computer motherboard, desktop computer motherboard, server motherboard, big game such large circuit board maintenance, mainboard motherboard and mobile phone as the maintenance of small small-sized chip.
2, the machine adopts touch human-machine interface, PLC control, always shows three temperature curve, shows three curve is the actual acquisition BGA temperature curve. Make temperature precise control in + 1 degrees.
3, fluctuation heating area chooses import by dynamic infrared heater, the upper outer technology, double really dark closed-loop control technology, whether BGA chip size without replacement wind tsui, convenient, accurate, high efficiency. The upper infrared heater motors automatic fluctuation.
4, upper and lower temperature area, may simultaneously setting independent heating temperature + 6 paragraph 6 paragraph constant temperature control, can also store 50 group temperature setting parameters.
5, using the upper heating and bottom heating temperature curve way, walk alone high-power cross-flow fan, ensure rapid cooling principle in PCB welding process, won't be out of shape.
6, desoldering and welding with alarm functions, completed in temperature abuse cases circuit can automatically without electricity, have overtemperature protection function.
7, for large heat capacity PCB and other high temperature requirements, lead-free solder can easily handle.
8, the shape, structure electromechanical integrated, installation and operation is very convenient